Wetting of grain boundaries in ultrafine-grained copper by liquid bismuth

Authors

  • A. Kosinova
  • B. Straumal
  • E. Rabkin

DOI:

https://doi.org/10.62721/diffusion-fundamentals.30.998

Keywords:

cu polycrystals, microstructure evolution

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Published

2017-12-01

How to Cite

Kosinova, A., Straumal, B., & Rabkin, E. (2017). Wetting of grain boundaries in ultrafine-grained copper by liquid bismuth. Diffusion Fundamentals, 30. https://doi.org/10.62721/diffusion-fundamentals.30.998

Issue

Vol. 30 (2017): Special Issue "Diffusion Fundamentals VII"

Section

Extended Abstracts

URN

http://nbn-resolving.org/urn:nbn:de:bsz:15-qucosa2-317370

License

Copyright (c) 2017 The author(s)

Creative Commons License

This work is licensed under a Creative Commons Attribution 4.0 International License.